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ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: ???? specification spec. no. rev 1.1 date 12. 26. 2012 product name AP6181 approved checked prepared dcc issue name
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: ampak AP6181 wi-fi 802.11b/g/n sip module spec sheet
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 1 revision history date revision content revised by version 2012/10/01 - initial released joe 1.0 2012/12/26 - modify pin name 29,30 brian 1.1
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 2 contents revision history ....................................................................................................... 1 ? contents ................................................................................................................... 2 ? 1. ? introduction ......................................................................................................... 3 ? 2. ? features ............................................................................................................... 4 ? 3. ? deliverab les ........................................................................................................ 5 ? 3.1 deliver ables .................................................................................................... 5 ? 3.2 regulatory cert ificati ons ................................................................................. 5 ? 4. ? general speci fication ......................................................................................... 6 ? 4.1 wi-fi rf s pecificat ion .................................................................................... 6 ? 4.2 volt ages .......................................................................................................... 7 ? 4.2.1 absolute ma ximum rati ngs .................................................................... 7 ? 4.2.2 recommended operating rati ngs ......................................................... 7 ? 5. ? pin assignm ents ................................................................................................. 8 ? 5.1 pcb pin outline .............................................................................................. 8 ? 5.2 pin defi nition .................................................................................................. 8 ? 6. ? dimensions ....................................................................................................... 10 ? 6.1 physical dimensi ons..................................................................................... 10 ? 6.2 recommended fo otprint .............................................................................. 11 ? 7. ? external clock reference .................................................................................. 12 ? 7.1 sdio pin de scripti on .................................................................................... 12 ? 8. ? host interface ti ming diag ram ........................................................................ 13 ? 8.1 power-up sequence timing diagr am ........................................................... 13 ? 8.2 sdio default mode timing diagr am ............................................................ 14 ? 8.3 sdio high speed mode timing diagr am ..................................................... 15 ? 9. ? recommended reflow profil e ......................................................................... 16 ? 10. ? packing informa tion ......................................................................................... 17 ? 10.1 label ........................................................................................................... 17 ? 10.2 dimension ................................................................................................... 18 ? 10.3 msl level / st orage condit ion ................................................................... 20 ?
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 3 1. introduction ampak technology would like to announce a lo w-cost and low-power consumption module which has all of the wi-fi functionalities. the highly integrated module makes the possibilities of web browsing, voip, headsets and other applications. with seamless roaming capabilities and advanced security, also could interact with different vendors? 802.11b/g/n access points in the wireless lan. this wireless module complies with ieee 802.11 b/g/n standard and it can achieve up to a speed of 72.2mbps with single stream in 802.11n draft, 54mbps as specified in ieee 802.11g, or 11mbps for ieee 802.11b to connect to the wirel ess lan. the integrated module provides sdio interface for wi-fi. this compact module is a total solution for wi -fi technologies. the module is specifically developed for tablet, smart phones and portable devices.
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 4 2. features ? single-band 2.4ghz ieee 802.11b/g/n ? supports standard interfaces sdio v2.0(50mhz, 4-bit and 1-bit) ? integrated arm cortex-m3 tm cpu with on-chip memory enables running ieee802.11 firmware that can be field-upgr aded with future features. ? security: i. hardware wapi acceleration engine ii. aes and tkip in hardware for fa ster data encryption and ieee 802.11i compatibility iii. wpa tm ? and wpa2 tm - (personal) support for powerful encryption and authentication a simplified block diagram of the m odule is depicted in the figure below.
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 5 3. deliverables 3.1 deliverables the following products and softwa re will be part of the product. ? module with packaging ? evaluation kits ? software utility for int egration, performance test. ? product datasheet. ? agency certified pre-tested report with the adapter board. 3.2 regulatory certifications the product delivery is a pre-tested module, without the module level certification. for module approval, the platform?s antennas are required for the certification.
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 6 4. general specification 4.1 wi-fi rf specification conditions : vbat=3.6v ; vddio=3.3v ; temp:25c feature description model name AP6181 wlan standard ieee 802.11b/g/n, wifi compliant host interface sdio dimension l x w x h: 12 x 12 x 1.5 (typical) mm frequency range 2.412 ghz ~ 2.4835 ghz (2.4 ghz ism band) number of channels 11 for north am erica, 13 for europe, and 14 for japan modulation 802.11b : dqpsk, dbpsk, cck 802.11g/n : ofdm /64-qa m,16-qam, qpsk, bpsk output power 802.11b /11mbps : 16 dbm 1.5 db @ evm ? -9db 802.11g /54mbps : 15 dbm 1.5 db @ evm ? -25db 802.11n /65mbps : 14 dbm 1.5 db @ evm ? -28db receive sensitivity (11n,20mhz) @10% per - mcs=0 per @ -85 1dbm, typical - mcs=1 per @ -84 1dbm, typical - mcs=2 per @ -82 1dbm, typical - mcs=3 per @ -80 1dbm, typical - mcs=4 per @ -77 1dbm, typical - mcs=5 per @ -73 1dbm, typical - mcs=6 per @ -71 1dbm, typical - mcs=7 per @ -69 1dbm, typical receive sensitivity (11g) @10% per - 6mbps per @ -87 1dbm, typical - 9mbps per @ -86 1dbm, typical - 12mbps per @ -85 1dbm, typical - 18mbps per @ -83 1dbm, typical - 24mbps per @ -81 1dbm, typical - 36mbps per @ -78 1dbm, typical - 48mbps per @ -74 1dbm, typical - 54mbps per @ -72 1dbm, typical receive sensitivity (11b) @8% per - 1mbps per @ -90 1dbm, typical - 2mbps per @ -89 1dbm, typical - 5.5mbps per @ -87 1dbm, typical - 11mbps per @ -84 1dbm, typical
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 7 data rate 802.11b : 1, 2, 5.5, 11mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54mbps data rate (20mhz ,long gi,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65mbps data rate (20mhz ,short gi,400ns) 802.11n : 7.2, 14.4, 21.7, 28. 9, 43.3, 57.8, 65,72.2mbps maximum input level 802.11b : -10 dbm 802.11g/n : -20 dbm operating temperat ure -30c to 85c storage temperature -40c to 85c humidity operating humidity 10% to 95% non-condensing storage humidity 5% to 95% non-condensing 4.2 voltages 4.2.1 absolute maximum ratings symbol description min. max. unit vbat input supply voltage -0.5 6.5 v vddio digital/bluetooth/sdio voltage -0.5 4.1 v 4.2.2 recommended operating ratings test conditions: at room temperature 25c symbol min. typ. max. unit vbat 3.0 3.6 4.8 v vddio 1.71 - 3.6 v note: the voltage of vddio is depended on system i/o voltage. test conditions: at operating temperature -10c ~65c symbol min. typ. max. unit vbat 3.0 3.6 4.8 v vddio 1.71 - 3.6 v note: vddio operating voltage range from 1.71v to 3.63v at operating temper ature is guaranteed.
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 8 5. pin assignments 5.1 pcb pin outline < top view > 5.2 pin definition no name type description 1 gnd ground connections 2 wl_bt_ant i/o rf i/o port 3 gnd ground connections 4 nc floating (don?t connected to ground) 5 nc floating (don?t connected to ground) 6 nc floating (don?t connected to ground) 7 nc floating (don?t connected to ground) 8 nc floating (don?t connected to ground) 9 vbat p main power voltage source input 10 xtal_in i xtal oscillator input 11 xtal_out o xtal oscillator output 12 wl_reg_on i internal regul ators power enable/disable 13 wl_host_wake o wlan wake-up host 14 sdio_data_2 i/o sdio data line 2 15 sdio_data_3 i/o sdio data line3
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 9 16 sdio_data_cmd i/o sdio command line 17 sdio_data_clk i/o sdio clk line 18 sdio_data_0 i/o sdio data line 0 19 sdio_data_1 i/o sdio data line 1 20 gnd ground connections 21 vin_ldo_out p internal buck voltage generation pin 22 vddio p i/o voltage supply input 23 vin_ldo p internal buck voltage generation pin 24 lpo i external low power clock input (32.768khz) 25 nc floating (don?t connected to ground) 26 nc floating (don?t connected to ground) 27 nc floating (don?t connected to ground) 28 nc floating (don?t connected to ground) 29 nc floating (don?t connected to ground) 30 nc floating (don?t connected to ground) 31 gnd ground connections 32 nc floating (don?t connected to ground) 33 gnd ground connections 34 nc floating (don?t connected to ground) 35 nc floating (don?t connected to ground) 36 gnd ground connections 37 nc floating (don?t connected to ground) 38 nc floating (don?t connected to ground) 39 nc floating (don?t connected to ground) 40 nc floating (don?t connected to ground) 41 nc floating (don?t connected to ground) 42 nc floating (don?t connected to ground) 43 nc floating (don?t connected to ground) 44 nc floating (don?t connected to ground) 45 tp1 (nc) floating (don?t connected to ground) 46 tp2 (nc) floating (don?t connected to ground) 47 tp3 (nc) floating (don?t connected to ground)
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 10 6. dimensions 6.1 physical dimensions (unit: mm) < top view > < side view > < top view >
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 11 6.2 recommended footprint (unit: mm) < top view >
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 12 7. external clock reference external lpo signal characteristics parameter lpo clock units nominal input frequency 32.768 khz frequency accuracy 30 ? ppm duty cycle 30 - 70 % input signal amplitude 1600 to 3300 mv, p-p signal type square-wave or sine-wave - input impedance >100k <5 ? pf clock jitter (integrated over 300hz ? 15khz) <1 hz external ref_clk sig nal characteristics 7.1 sdio pin description the module supports sdio version 2.0 for 4-bit modes it has the ability to stop the sdio clock and map the interrupt signal into a gpio pin. this ?out-of-band? interrupt signal notifies the host when the wlan device wants to turn on the sdio interface. the ability to force the control of the gated clocks from within the wlan chip is also provided.
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 13 ? function 0 standard sdio function (max blocksize / bytecount = 32b) ? function 1 backplane function to acce ss the internal system on chip (soc) address space (max blocksize / bytecount = 64b) ? function 2 wlan function for efficient wlan packet transfer through dma (max blocksize/bytecount=512b) sdio pin description 8. host interface timing diagram 8.1 power-up sequence timing diagram wl_reg_on: internal regulat ors power enable/disable. this pin must be driven high or low (not left floating). sd 4-bit mode data0 data line 0 data1 data line 1 or interrupt data2 data line 2 or read wait data3 data line 3 clk clock cmd command line
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 14 8.2 sdio default mode timing diagram
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 15 8.3 sdio high speed mode timing diagram
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 16 9. recommended reflow profile referred to ipc/jedec standard. peak temperature : <250c number of times : ? 2 times 10 2.5 /sec 2.5 c / sec 40~70 sec 250
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 17 10. packing information 10.1 label label a ? anti-static and humidity notice label b ? msl caution / storage condition label c ? inner box label . label d ? carton box label .
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 18 10.2 dimension
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 19 a b c humidity indicator desiccant c d
ampak technology inc. www.ampak.com.tw proprietary & confidential information doc. no: 20 10.3 msl level / storage condition note : accumulated baking ti me should not exceed 96hrs

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